5170-IH

The 5170-IH is a film frame test handler designed for leadless devices such as QFN, BGA, WLCSP, CSP, DFN, and Panel Level Packages (PLP). By directly testing diced devices on the wafer ring, it achieves highly precise alignment correction and stable contact, enabling high-quality semiconductor inspection. With X, Y, Z, and θ correction via the visual alignment (auto-calibration) feature, uniform contact conditions are maintained across all tested devices, balancing high-speed indexing with stable measurement performance. Furthermore, an optional conversion kit supports standalone panel handling, flexibly accommodating high-volume inspection for PLP (Panel Level Package), a next-generation packaging technology.

Feature

• Wide Support for WLCSP, QFN, BGA, and PLP
 Supports evaluation and high-volume inspection for advanced semiconductor packages.
• High-Precision Contact via Wafer Ring Testing 
Visual position correction achieves stable contact pressure and high measurement repeatability.
• Panel Transport Option 
Switchable between ring transport and standalone panel transport to adapt to diverse production lines.
• High-Throughput Mass Production Inspection 
Multi-parallel testing achieves high productivity and stable quality control.
• Smart Factory Ready 
Compliant with SECS/GEM, various SEMI standards, and CE marking, supporting automation and traceability management.