5170-IH

The 5170-IH is the handler to test leadless devices such as QFN, BGA, WLCSP, and Panel (PLP = Panel Level Package) diced on the wafer ring. It is capable of hot and cold temperature testing. Stable testing and high-speed indexing of the devices on the ring are supported by precise device positioning information and optimized probe-pin contact pressure that are ensured by positioning (x, y, z, θ) compensation before testing.
With the optional panel conversion kit, it is also possible to transport and test panels directly without using a ring.

Feature

・High throughput
・High withstand load and high thrust table
・Expanded strip attachment area: up to 300 mm (L) × 300 mm (W)(up to ⌀300 mm for WLCSP)
・Panel handling option: up to 300 mm (L) × 300 mm (W)
・Conversion between Panel and Ring handling available
・LOT control with barcode/2D code reader
・Easy device type conversion - test socket replacement and display screen setting
・Auto-cleaning function of socket with programmable timing
・6/8/12 inches ring conversion
・CE marking compliant
・SEMI standards compliant (S2/S8, G85/E142, SECS/GEM (E5, E30, E37), F47)
・Maximum test temperature: 155℃
・Minimum test temperature: −45℃
・Upgrade from the ambient temperature system to the temperature control system available at the installed location