Products
Product
Test Systems
Handlers
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DC Static Characteristics and Inductive Load (UIS/Avalanche Ruggedness) One-Pass Test System for SiC/GaN Power Semiconductors
471-TT Version LA
The 471-TT Version LA is a fully automated wafer-level (CP process) test system for power semiconductors, including SiC MOSFETs, GaN FETs, Si MOSFETs, and IGBTs. In addition to DC static characteristic measurements such as breakdown voltage (Vds/Vdss), leakage current (IDSS), threshold voltage (Vgs(th)), and on-resistance (Rds(on)), the system enables continuous one-pass (single-contact) testing of avalanche ruggedness and avalanche energy under inductive load switching conditions using UIS/UIL (Unclamped Inductive Switching) methodology. Equipped with high-power test capability of up to 2 kV and 200 A, the system supports volume production inspection and KGD (Known Good Die) screening for both 200 mm (8-inch) and 300 mm (12-inch) wafers. Through full integration with Tokyo Seimitsu wafer probers (UF2000 and AP3000 with DARUMA Chuck), the 471-TT Version LA delivers high-quality and high-efficiency testing solutions for automotive and industrial power devices.
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High-Throughput Wafer Parallel Testing Capability: Supports 8/16 Parallel and UIS Testing
471-TT
471-TT is a DC test system for power devices that enables simultaneous testing of multiple dies in the wafer testing process. Supporting simultaneous testing for 8-parallel and 16-parallel configurations, it achieves a significant throughput improvement compared to conventional single-testing methods. It contributes to enhancing productivity and reducing test costs in the mass production inspection process of power semiconductors, providing a highly efficient wafer testing environment. In addition, inherited from TESEC's accumulated high-voltage and high-current measurement technology, it supports high-voltage application of up to 2kV. It not only enables high-precision evaluation of DC characteristics for various power semiconductor devices such as SiC MOSFETs, GaN HEMTs, IGBTs, and diodes, but also supports avalanche measurement, which is in high market demand. Through this, it assists in quality evaluation, reliability evaluation, and inspection efficiency improvement in mass production processes for SiC devices and next-generation power semiconductors. Furthermore, it supports capacitance measurements such as Rg and Ciss, which are frequently requested. High-speed data transfer via LAN communication and high-speed relay switching functions shorten test times, contributing to tact time improvements across the entire production line. It is the optimal test solution for the high-volume production power semiconductor market, including power semiconductors for EVs, inverters for industrial equipment, and devices for renewable energy applications.
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High-Voltage and High-Current Characterization System for SiC/GaN/IGBT
431-TT
The 431-TT is a high-performance DC test system supporting static characterization of a wide range of power semiconductor devices, including SiC (silicon carbide), GaN (gallium nitride), IGBTs, MOSFETs, power transistors, and diodes. Covering a broad array of applications from R&D and evaluation to mass production processes, it delivers high-precision, highly efficient characterization of power devices requiring high-voltage and high-current measurement. The standard configuration supports up to 1.2 kV / 65 A (130 A between C-E), while the expanded configuration supports up to 2.2 kV / 200 A. Adding optional units makes it possible to build a measurement environment capable of up to 10 kV / 1200 A. Meeting the demands for higher breakdown voltages and larger currents in next-generation power semiconductors, it provides an optimal test solution for developing and quality-evaluating devices aimed at EVs (electric vehicles), renewable energy systems, industrial equipment inverters, and power supply units. In addition, seamless integration with probers and handlers allows for an end-to-end evaluation environment from wafer testing to final testing, achieving both increased productivity and high-quality device evaluation.
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Evaluation of Power Modules and Smart Power Devices
530-IT
530-IT is a test system optimized for the evaluation and inspection of IPDs (Intelligent Power Devices) and IPMs (Intelligent Power Modules), fusing TESEC's accumulated power device measurement technology with IC tester technology. Capable of handling complex power semiconductor products that integrate logic ICs and power devices, it can be utilized for a wide range of applications from characteristic evaluation in the development stage to quality inspection in the mass production process. In recent years, IPMs and power modules used in electric vehicles (EVs), industrial machinery, air conditioners, servo motors, and renewable energy systems increasingly feature integrated advanced protection and control circuits. The 530-IT is equipped with a diverse range of power supplies and measurement capabilities required for evaluating the characteristics of these high-functionality power semiconductors, efficiently assessing device performance and reliability. Additionally, it supports high-voltage and high-current measurements up to 2.2kV / 67A, with expandable configurations allowing evaluation up to 200A. Furthermore, with capabilities for integration with external measuring instruments and parallel testing functionality, it provides a highly scalable test platform that flexibly adapts to the diversifying power semiconductor market.
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Power Semiconductor Dynamic Characteristics Test System | Eon/Eoff, trr Evaluation
3430-SW
3430-SW is a dynamic test system for power semiconductors designed to quickly and accurately evaluate the dynamic characteristics of IGBTs and MOSFETs. It enables evaluation under conditions close to actual device operation, including switching time measurement, short-circuit withstand capability testing (I-Short), and reverse recovery characteristics (trr) evaluation. High efficiency and high reliability are required for modern power semiconductors such as SiC MOSFETs and high-voltage IGBTs. The 3430-SW supports test conditions up to the 1500V and 1000A class, assisting in the development and quality evaluation of devices for EV inverters, industrial machinery, and renewable energy power conversion systems.
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Power Semiconductor Thermal Resistance Measurement System | Compatible with SOA Testing and Reliability Evaluation
4324-KT
4324-KT is a system designed for thermal resistance measurement and SOA (Safe Operating Area) evaluation of power semiconductor devices such as transistors, diodes, MOSFETs, and IGBTs. Transient thermal resistance measurement allows for the evaluation of device heat generation characteristics, while safe operating area testing verifies reliability and durability. In high-reliability applications such as automotive power semiconductors for EVs, industrial inverters, and power conversion equipment for renewable energy, thermal design and reliability evaluation are critical. Since the 4324-KT can perform both thermal characterization and SOA testing in a single unit, it contributes to improved development efficiency and enhanced quality assurance.
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GaN HEMT Thermal Resistance Tester | Transient Thermal & Characterization Evaluation System
4408-KT
The 4008-KT is a thermal characterization system designed for high-precision measurement of transient thermal resistance in next-generation power semiconductor devices, including GaN HEMTs. By utilizing the change in VGS (ΔVGS) corresponding to temperature variation, it evaluates thermal resistance characteristics and quantitatively analyzes the heat generation and dissipation performance of devices. It provides an optimal solution for thermal evaluation in R&D, quality assurance, and volume production lines for GaN power devices. In the high-density packaging semiconductor market—such as EV power supply systems, high-efficiency power converters, and GaN power devices for industrial equipment—the importance of thermal design is growing continuously. The 4008-KT quickly and accurately measures thermal resistance (Rth) and temperature rise (ΔT), supporting improvements in device performance and reliability.
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UIS Tester for Avalanche Capability Evaluation | MOSFET & Power Semiconductor Reliability Testing
4602-LV
The 4602-LV is an UIS tester (L-load tester) designed for avalanche capability testing and reliability evaluation of power semiconductor devices, including MOSFETs. By monitoring operation waveforms during inductive load turn-off and performing evaluations based on the SOA (Safe Operating Area), it accurately judges device durability and quality. Furthermore, it supports VDS(SUS) measurement under specified current conditions, making it suitable for a wide range of applications from product development to mass production quality assurance. In recent years, MOSFETs and power devices used in electric vehicles (EVs), industrial inverters, power supply equipment, and other applications have seen progress toward lower on-resistance and higher currents. Consequently, cases where sufficient evaluation is difficult using conventional methods are increasing. The 4602-LV adopts new measurement methods such as VD-OFF mode and Time-Trip mode to achieve avalanche testing in high-current environments. Furthermore, it supports test conditions up to 300V and 200A, meeting the evaluation needs of automotive MOSFETs and high-reliability power semiconductors.
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Strip Frame Test Handler | High-Parallel Testing & High/Low Temperature Test Compatible
5880-IH
The 5880-IH is a high-performance strip frame test handler. It enables the inspection of semiconductor devices on strip frames without singulation. By combining a high-load, high-precision stage with advanced position correction technology, it achieves high-throughput testing through high-parallel measurement. This contributes to increased production capacity and reduced inspection costs in mass production processes, leading to improved overall efficiency at semiconductor manufacturing sites. Furthermore, it supports high and low temperature testing from -55°C to +170°C, delivering highly reliable mass production inspection. As an optimal solution for strip inspection of SO packages and QFN devices, it supports the stable supply of high-quality semiconductor products.
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MAP Test Handler | Film Frame Inspection Equipment for QFN, BGA, WLCSP, and PLP
5170-IH
The 5170-IH is a film frame test handler designed for leadless devices such as QFN, BGA, WLCSP, CSP, DFN, and Panel Level Packages (PLP). By directly testing diced devices on the wafer ring, it achieves highly precise alignment correction and stable contact, enabling high-quality semiconductor inspection. With X, Y, Z, and θ correction via the visual alignment (auto-calibration) feature, uniform contact conditions are maintained across all tested devices, balancing high-speed indexing with stable measurement performance. Furthermore, an optional conversion kit supports standalone panel handling, flexibly accommodating high-volume inspection for PLP (Panel Level Package), a next-generation packaging technology.
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Die Sorter
4605-HTR
4605-HTR is designed to test the leadless devices diced on the UV film of the wafer ring such as QFN, BGA, and WLCSP. This high speed die sorter picks up non-defective devices from the film based on the MAP file measured in the front-end process, performs the 6 dimensional visual inspection, and then store them to embossed carrier tapes. As a high-speed sorting machine compatible with the wafer ring size of up to 12 inches, it helps to achieve a significant improvement in the efficiency of inspection process. Equipped visual inspection and handling systems satisfy the stringent standard of WLCSP and Wettable Flank-plated QFN. Proven track records of this handler include the contributions to the automotive semiconductor and the installation to the class 10000 cleanrooms (ISO 7).
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Gravity Handler
4330-IH
4330-IH is a gravity tri-temp handler having a large capacity chamber to perform the environment measurement of power devices such as TO220, D-PAK, D2-PAK, and DIP.High UPH (14,400 pcs.) is accomplished while keeping 120 seconds of Soak time for TO220 and D2PAK by implementing at a maximum of 8 test sites (when socket contactor is used). Temperature control accuracy of ±2℃ is guaranteed in the range of −60℃ to 0℃ for Cold Temp as well as 50℃ to 175℃ for Hot Temp.
LT4530
LT4530 series are available in two different configurations. T4530-T LT4530T is the latest model which features a high throughput capability, 8 sites , hot and cold temperature testing, and high-frequency contacts. High utilization rate of this handler is achieved by thorough preventions of jams and lead deformations. With the high throughput and the high reliability, LT series is highly evaluated globally. LT4530-D This version features 4 sites and hot temperature testing. High utilization rate of this handler is achieved by thorough preventions of jams inherited from the LT9900.
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MEMS Handler
4664-IH
The ULTRA is a test handler designed for final test of Micro-Electro-Mechanical Systems (MEMS) such as Accelerometers and Gyroscopes. It provides the 6DOF (3-axis acceleration + 3-axis gyroscope) measurement under hot and cold environment at a maximum of 96 multi-site test. The test station unit called ULTRA L is also ready to provide the manual measurement for research and development purpose.
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TAB Handler
AH9710T
The AH9710 is the auto handler for TCP and COF to test the electrical characteristics of ICs which are inner-bonded to the 35 mm, 48 mm, or 70 mm width tape carrier. The TAB tape is sent from the supply reel (upper) to the test site at any set pitch and positioned very accurately with respect to X and Y directions. Then the electrical characteristics are tested by the contactor which is connected to the tester. Based on the test results, the tested IC is sorted, and the TAB is wound up on the receive reel (lower). All the processes are automatically performed.
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